List of the Ongoing/Completed Projects
S.No. |
Name of Agency |
Title of the project |
Period of support |
Completed/ |
1. |
SiC surface
treatment and passivation using organic monolayers for high power device
applications (PI) |
SiCamore Semi, USA |
2020-2022 |
Ongoing |
2. |
DST, India (BRICS project) (PI) |
Wide
Bandgap Semiconductor (Al) GaO/Nitrides Heterostructures for High Power Electronic and
Optoelectronic Devices |
2020-2023 |
Ongoing |
3. |
MHRD and IIT Delhi (PI) |
MBE growth
of 2D materials and van der Waals heterostructures for
applications in sensors and optoelectronic devices |
2019 -2024 |
Ongoing |
4. |
SSPL, DRDO, Delhi (PI) |
Fabrication
of high quality ohmic and Schottky contacts on Ga2O3 |
2019-2020 |
Completed |
5. |
Meity, DST
and IIT Delhi (Co-PI) |
Applications
of non-silicon based nanofabrication technologies and nanoscale devices |
2018-2023 (Five
years) |
Ongoing |
6. |
DST, New Delhi (PI) |
Fabrication
of efficiency enhanced nanostructured InGaN/GaN solar cells |
2016-2019 |
Completed |
7. |
DST-DAAD (Indo-German joint project) (PI) |
Fabrication
of Vertically Standing GaN Nano-Rods and
Nano-Wires using Nano-Masking and Etching Techniques for Applications in
Nano-PN Junctions and Nano-LEDs |
2013 – 2015 |
Completed |
8. |
Nanomission program,
DST, New Delhi (PI) |
Fabrication
of vertically standing GaN Nanorods and nanowires using nanomasking and etching techniques for applications
in nano-pn junctions and nanoLEDs |
2013 – 2016 |
Completed |
9. |
BRNS, DAE (PI) |
Study
of Ion Implantation-induced layer splitting of Ge and GaSb for potential heterointegration applications |
2012 – 2015 |
Completed |
10. |
DeitY, New
Delhi (Co-PI) |
Non-silicon
based Technologies for Nanofabrication and Nanoscale Devices |
2010-2017 |
Completed |
11. |
DRDO,
Delhi (PI) |
Study
of metal-semiconductor contacts based on GaN |
2009-2011 |
Completed |
12. |
IIT
Delhi (PI) |
Establishment
of low frequency noise set up (Young faculty grant) |
2008-2011 |
Completed |
13. |
Max Planck Society, Germany & DST, India (PI) |
Wafer
bonding and layer transfer for novel engineered substrates |
2007-2011 |
Completed |