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MCL348: THERMAL MANAGEMENT OF ELECTRONICS

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• Details of Assignment-1
• Attendance till Midsem
• Evaluation policy
• Course Contents and Books

Lecture Notes

• Introduction to Thermal Management of Electronic Systems
• Basic Thermodynamics of An Electronic System
• Granularity of Thermal Management of Electronic Systems
• Thermodynamics of Computing Process
• Chip Level Thermal Management
• Diffusion of Heat Generated in A Chip: Conduction Analysis
• Principles for Creation of Compact Thermal Models
• Methodology of Deriving Compact Thermal Models For Chips
• Analytical Solutions to Detailed Thermal Modeling of Chip Packages
• Fourier’s Solutions to Detailed Thermal Modeling of Chip Packages
• Internal Heat Spreaders in Chip Packaging
• Spreading/Constriction Resistance
• Thermal Interfacing Materials for Electronic Packaging
• Oriented Structural Design of Thermal Interface Materials
• Thermal Management of Printed Circuit Boards
• EFFECTIVE THERMAL CONDUCTIVITY OF A PCB
• Advanced Method for Estimation fo EFFECTIVE THERMAL CONDUCTIVITY OF A PCB
• Thermal Management thru Natural Convection Cooling
• Thermal Management thru Natural Convection Cooling of Horizontal PCBs
• Thermal Management thru Natural Convection Cooling of Vertical PCBs
• Thermal Management thru Forced Convection Cooling of Printed Circuit Boards
• Optimum Stacking of Printed Circuit Boards
• Extended Surfaces for Better Thermal Management of Chip on Board
• Methodology for Development of Least Weight Fins
• Heatsinks for Natural Convection Cooling of Electronics
• Natural Convection Heat Sinks : Single Phase Immersion Cooling (SPIC)

Sample Problems and solutions

Sample Problems on CTM

Reading Material