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MCL348: THERMAL MANAGEMENT OF ELECTRONICS

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Assignment-1

Assignment-2

Problem Statement for Coure Project

• Evaluation policy
• Course Contents and Books

Lecture Notes

• Introduction to Thermal Management of Electronic Systems
• Granularity of Electronic Systems and Thermal Management
• Information Entropy Vs Thermodynamic Entropy
• Towards Reversible Computing (Electronic Systems)
• Irreversible Nature of Practical Electronic Systems
• Basics of Thermal Management
• Governing Equations for Thermal Management of An Electronic Processor
• Steady State Electronic Processor & Analytical Description
• Electrical Analogy Approach for Thermal Management of Electronic Processors
• Thermal Management in Electronics Packaging
• Modelling of Constriction Resistance in Chip Packaging
• Recent Chip Packaging Methods
• Chip Packaging & Tools for Design Level Thermal Management-1
• Chip Packaging & Tools for Design Level Thermal Management-2
• Convection Cooling for Thermal Management of PCBs
• Analysis of Forced Convection Heat Transfer in PCBs
• Transport Analogy of Forced Convection Heat Transfer in PCBs
• Extended Surfaces for Better Thermal Management of Chip on Board
• Design of Fins for Thermal Management of Chip on Board
• Design of Least Weight Fins for Thermal Management of Chip on Board
• Thermal Management of Electronics using Fin Array Systems
• Thermal Management of Electronics using Natural Convection Fin Array Systems
• Thermal Management of Electronics using Forced Convection Fin Array Systems
• Selecting the Right Heat Sink for your Design – Steps for Heat Sink Calculation and Selection:Level-1
• Selecting the Right Heat Sink for your Design – Steps for Heat Sink Calculation and Selection:Level-2
• Selecting the Right Heat Sink for your Design – Steps for Heat Sink Calculation and Selection:Level-3
• Advanced Heat Sinks for Thermal Management of High-Power Electronics
• Structure of Vapor Chambers for Thermal Management of High-Power Electronics
• Heatpipe Heat Sinks
• Operational Aspects of Heat Pipe Heat Sinks
• High Performance Ultra Thin Heat Pipe Cooling Module for Mobile Handheld Electronic Devices
• Investigation of ultra-thin flattened heat pipes
• Thermal management of electronic devices using Direct Immersion Boiling Process
• Thermal management of electronic devices using Direct Immersion Flow Boiling Process
• Thermal Management of Electronic facilities
• OPEN THERMAL DESIGN OF DATA CENTERS
• DESIGN OF ADAPTIVE & EFFICIENT DATA CENTERS
• Thermal Control of Space Electronics Systems
• Radiation Analysis of Space Systems
• State-of-the-Art Thermal Controls of Satellites

Sample Problems and solutions

Reading Material